任職要求: 1)At least 3-5 years working experience in Semiconductor, plating process experience is plus 3-5年半導(dǎo)體經(jīng)驗,熟悉電鍍制程 2)Problem solving skill is needed. Good understanding.Good learning ability. Good execution. 良好的問題解決能力及溝通、學習能力 職位描述: 1)Responsible for plating process&related process control. 負責電鍍以及相關(guān)站別制程管控; 2)Daily analysis and check chemical solution; 日常的電鍍藥水的檢查與分析; 3)Abnormal case analysis and improve, follow up Product lot qualtiy; 現(xiàn)場異常分析解決,生產(chǎn)產(chǎn)品品質(zhì)跟蹤; 4)SOP/SPEC/FMEA/control plan/SPC review and upadte, data&reprot collect and summary; 操作文件規(guī)范的更新,數(shù)據(jù)報告收集跟蹤整理; 5)ENG report/8D report prepare and update; 工程報告/8D報告的準備與提交; 6)Others arrange jobs from supervisor; 主管安排的其他事宜; 原標題:《電鍍工程師》