Duties & Responsibilities: 1.Response to OSA spec and requirement from customer;Define and release product test spec and spec on sub-assemblies and components. 2.Build and release product BOM structure 3.Generate process and test flow chart, and release the PMP document, and setup MES system Department information systems, records, reports and metrics are accurate and generated on time 4.Drive yield improvement activities, generate yield report, failure modes analysis, coordinate supporting divisions reach yield target; 5.Generate and maintain cost model in perspectives of components cost, HPU, predict cost roadmap, lead cost reduction activities. 6.Coordinate reliability test, responsible for failure analysis. 7.Lead Design for Manufacturing (DFM) review, working with design engineers to generate report. Qualification & Requirements: 1.Master or above, majored in Physics, Optical Communications, Material Engineering, Semi-conductor, or equivalent. 2.More than 10 years’ work experience in high speed optics packaging field with product engineer role. 3.Ability to recommend and implement improvements. 4.Good communication skills in both English and Chinese. 5.Must be self-motivated with capability working under pressure.