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該崗位為Apple 產(chǎn)品可靠性崗位，display/battery/iphone/mac方向均可，工作地點(diǎn)有上海/深圳/成都。

崗位職責(zé)

1. 準(zhǔn)備簡(jiǎn)明詳細(xì)的可靠性測(cè)試計(jì)劃，開(kāi)發(fā)新的可靠性測(cè)試、程序和規(guī)范 ?

2. 以清晰的組織形式報(bào)告測(cè)試結(jié)果，并強(qiáng)調(diào)或優(yōu)先級(jí)以滿足具有挑戰(zhàn)性的項(xiàng)目截止日期 ?

3. 分析測(cè)試數(shù)據(jù)，協(xié)助跨職能團(tuán)隊(duì)進(jìn)行故障分析，為可靠性決策提供依據(jù) ?

4. 利用先進(jìn)的技術(shù)來(lái)了解測(cè)試失敗的根本原因。與研發(fā)部交流測(cè)試結(jié)果，解決遇到的問(wèn)題。

任職資格 ?

1. 有主板測(cè)試、電子芯片封裝和測(cè)試經(jīng)驗(yàn)。

2. 良好的英語(yǔ)口語(yǔ)和書(shū)面表達(dá)能力。 ?

3. 熟悉環(huán)境或機(jī)械應(yīng)力測(cè)試，如高溫高濕、跌落、振動(dòng)測(cè)試;或了解JEDEC, IEC, ASTM等測(cè)試標(biāo)準(zhǔn)

4. 熟悉常用的失效分析技術(shù)，如顯微鏡、x射線、ct掃描、SEM、TEM、FIB、EDS、LIT、CSAM… ?

5. 有一定的統(tǒng)計(jì)學(xué)知識(shí)。熟悉DOE, FMEA, SPC或六西格瑪認(rèn)證。 ?

6. 能夠接受出差，理工科本科及以上學(xué)歷，電子工程相關(guān)專業(yè)。

Responsibilities We are seeking a highly motivated individual with background in creation and execution of reliability tests and identification of potential failure modes. You will be responsible for developing and executing novel test methodologies to validate the robustness of products, sub-assemblies, modules, and supplier technologies. In addition, the candidate will coordinate failure analysis to identify root causes and corrective actions. Job describtion ? Preparing concise and detailed reliability test plans ? Developing new reliability tests, procedures, and specifications ? Reporting test results in clearly organized formats, and with emphasis or prioritization to meet challenging project deadlines ? Analyzing test data to assist cross functional teams’ failure analysis and offer basis of reliability decision making ? Scoping state-of-the-art techniques to understand test failure’s root cause. Interacting with diverse cross functional teammates to communicate test results and provide inputs for problem solving as a whole team. Qualifications ? Familiar with environmental or mechanical stress tests, such as high temperature high humidity, drop, vibration test; or some knowledge of test standards from JEDEC, IEC, ASTM… ? Familiar with common failure analysis techniques such as microscopy, X-ray, CT-scan, SEM, TEM, FIB, EDS, LIT, CSAM… ? Some level of statistics knowledge. Familiar with DOE, FMEA, SPC, or Six Sigma certified. ? Excellent interpersonal skills: the candidate must feel comfortable to express opinions in front of audience at all grades. Able to stand up for what is right based on data, meanwhile be openminded and thus able to listen and understand other team members’ thoughts. ? Multi-tasking and good at time management so as to report data/results timely under big time pressure. ? Strong attention to details among large amount of technical data. ? Eager to step out of comfort zone to explore uncharted territories, which need some self learning or develop some new skills for new projects or un-precedent tasks. ? Good at both verbal and written English. ? Able to travel unrestrictedly. Education and Experience ? Bachelor degree or above in science or engineering. Major in electronic engineering is preferred. ? Preferred - experience on SMT or PCB, or electronic chip, or electronic chip packaging and testing.